hermetically sealed, transistor output optocouplers reliability data sheet description the reliability data shown includes agilent reliability test data from the past three years on this product family. all of these products use the same leds, the same logic gate ics, the same dscc approved packaging materials, processes, stress conditions and testing. the data in tables 1 and 2 reflect actual test data on dual channel devices. the single channel hcpl- 5501 data in table 3 is inferred from the demonstrated life test data using the factor (1.5) found in the photodiode detector isolator section of mil-hdbk- 217, combined with any single channel data obtained. this data definition of failure inability to switch, i.e., functional failure, is the definition of failure in this data sheet. specifically, failure occurs when the device fails to switch on with 2 times the minimum recommended drive current (but not exceeding the max. rating) or fails to switch off when there is no input current. failure rate projections the demonstrated point mean time to failure (mttf) is measured at the absolute maximum stress condition. the failure rate projections in tables 2 and 3 use the arrhenius acceleration relationship, where a 0.43 ev activation energy is used as in the hybrid section of mil- hdbk-217. applications information the data of tables 1, 2, and 3 were obtained on mil-prf-38534 screened devices with high temperature operating life duration up to 5000 hours. an exponential (random) failure distribution is assumed, expressed in units of fit (failures per billion is taken from testing on agilent technologies devices using internal agilent processes, material specifications, design standards, and statistical process controls. they are not transferable to other manufacturers similar part types. device hours) are only defined in the random failure portion of the reliability curve. for valid system reliability calculations, it is necessary to adjust for the time when the system is not in operation. note that if you are using mil- hdbk-217 for predicting component reliability, the results may not be comparable to those given in tables 2 and 3 due to the different conditions and factors operating life test table 1. demonstrated operating life test performance, 4N55/883b demonstrated demonstrated stress test total devices total device number of mttf (hr)@ fits @ condition tested hours failed units t a = +125 ct a = +125 c i f = 20 ma 430 1,700,000 0 >1,700,000 <588 i out = 25 ma v cc = 18 v t a = +125 c t j = +135 c agilent 5962-8767901ex, 5962-8767905kex 4N55/883b, hcpl-257k 5962-8767902px, 5962-8767906kpx hcpl-5531, hcpl-553k 5962-9085401hpx, 5962-9085401kpx hcpl-5501, hcpl-550k 5962-87679032a, 5962-8767907k2a hcpl-6531, hcpl-653k 5962-8767904fc, 5962-8767908kfc hcpl-6551, hcpl-655k
www.semiconductor.agilent.com data subject to change. copyright ? 2000 agilent technologies, inc. obsoletes 5967-6010e 5968-9394e (2/00) environmental testing all high reliability hermetic optocouplers listed meet the 100% screening and quality conformance inspection testing of mil-prf-38534, class h or class k as applicable. table 4. esds classification per method 3015, mil-std-883 that have been accounted for in mil-hdbk-217. for example, it is unlikely that your application will exercise all available channels at full rated power with the led(s) always on as agilent testing does. thus, your application total power and duty cycle must be carefully considered when comparing tables 2 and 3 to predictions using mil-hdbk-217. electrostatic discharge sensitivity part number esd class 5962-8767905kex, hcpl-257k 1 5962-8767901ex, 4N55/883b 1 5962-8767906kpx, hcpl-553k 3 5962-8767902px, hcpl-5531 3 5962-9085401kpx, hcpl-550k 1 5962-9085401hpx, hcpl-5501 1 5962-8767907k2a, hcpl-653k 1 5962-87679032a, hcpl-6531 1 5962-8767908kfc, hcpl-655k 3 5962-8767904fc, hcpl-6551 3 table 3. reliability projections for single channel devices listed in title typical (60% confidence) 90% confidence ambient junction mttf fits mttf fits temperature ( c) temperature ( c) (hr/fail) (fail/10 9 hr) (hr/fail) (fail/10 9 hr)) 125 130 2,786,000 359 1,881,000 531 120 125 3,252,000 307 2,198,000 455 110 115 4,484,000 223 3,037,000 329 100 105 6,289,000 159 4,268,000 234 90 95 8,983,000 111 6,110,000 164 80 85 13,090,000 76 8,924,000 112 70 75 19,491,000 51 13,320,000 75 60 65 29,713,000 34 20,359,000 49 50 55 46,477,000 22 31,933,000 31 40 45 74,774,000 13 51,525,000 19 30 35 124,069,000 8 85,760,000 12 25 30 161,833,000 6 112,046,000 9 table 2. reliability projections for dual channel devices listed in title typical (60% confidence) 90% confidence ambient junction mttf fits mttf fits temperature ( c) temperature ( c) (hr/fail) (fail/10 9 hr) (hr/fail) (fail/10 9 hr)) 125 135 1,855,000 539 738,000 1,354 120 130 2,159,000 463 859,000 1,164 110 120 2,959,000 338 1,177,000 849 100 110 4,122,000 243 1,640,000 610 90 100 5,845,000 171 2,326,000 430 80 90 8,450,000 118 3,362,000 297 70 80 12,474,000 80 4,964,000 201 60 70 18,837,000 53 7,496,000 133 50 60 29,157,000 34 11,603,000 86 40 50 46,370,000 22 18,452,000 54 30 40 75,964,000 13 30,229,000 33 25 35 98,403,000 10 39,158,000 26
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